Compliant tube based headphone pad idea I had while riding a bicycle two days ago. I got the thickness and dimensions dialed for printing and bending, but I either need to setup my old KP3 kingroon with a longer 2040 Z extrusion or print this in 2 pieces. Either way, the joint connection needs more than just the overlap and glue. TPE would probably be better too, although I have no idea what shore hardness this $10 clearance spool of TPU has. The sound quality seems a little tinny and I have no way to tell how loud it is externally, but it is just my first iteration that I can put around my ear and test. TPU is so slow to print and the moisture levels impact the qualities drastically. I actually like the texture and properties of wet TPU more than dry, but it is hard to get it just right. With the design’s compliant bend, consistency is kinda important. Anyways, just another boring project. On the bright side, this seems cooler temperature wise when the TPU pad is against my ear.
I spent all day chasing custom logarithmic infill patterns that might incorporate a compliant bend but only learned about how not to do a thing like that in CAD.
Mostly, the design is motivated by the aesthetics, but also TPU sucks at bridging and supports.
Testing the loudness really needs two sides and a later stage prototype. It is also very subjective without a repeatable testing technique. I personally loath the subjective nature of opinions people have about anything audio related and avoid saying anything about such myself to the best of my ability.
The overlapping joint insert was just a first idea for a design. There is a section at the top of this joint that I didn’t bother to optimise for vase mode but the rest of the print is possible. It would take some tuning to get vase mode fully dialed. I would probably need to use some helix trickery to get the exact stiffness where I need it. Vase mode was and is still likely in the cards.
I also have a design in CAD that I made today. It has an exposed infill pattern and solid shell in places. I used the pictured design to conceptualize how the infill would behave and how much movement to expect. I may never print that one. I still don’t have a way to connect it that I like.
I’m also playing with the idea of covering a print in textile materials and or altering pockets and chambers.
You don’t find many printed headphone pads and the ones that do exist are very ugly IMO. Prototyping in yellow is only just that. I have other colors of TPU on hand.
Overall, this has the potential to dial in many properties from fit to audio properties. The orientation is ideal for the properties of TPU. The abstract concept is broadly universal where this will technically work for the majority of headphones. As is, it doesn’t look terrible in person and I can make this much prettier if I choose.
The pictured setup is an early alpha phase prototype and it is not glued while it is close to the right size so just the friction is holding it together in the pic. I could glue this and it would likely work fine.